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Capabilities &
Specs. |
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| Layers: |
1 to 28 Layers |
| Base Materials: |
XPC FR1 FR2 CEM1 CEM3 , FR4, High TG , 铝基板,陶瓷板 |
| Base Copper Thickness: |
1/2 oz. to 4 oz. |
| BoardThickness: |
0.1mm-6mm |
| Maximum Panel Size: |
1200mm x 1200mm |
| Minimum Hole Diameter: |
0.1mm (4mil) |
| PTH Hole Tolerance: |
0.05mm |
| Aspect Ratio: |
12:1 |
| Blind or Buried Via: |
yes |
| Minimum Line Width: |
0.075mm (3mil) |
| Minimum Line Spacing: |
0.075mm (3mil) |
| Minimum Bonding Pitch: |
0.075mm (3mil) |
| Minimum SMT Pitch: |
0.2mm " (center to center) |
| Mechanical Fabrication: |
Minimum Hole registration tolerance (NPTH):
+/-0.076
Minimum Hole registration tolerance (PTH):
+/-0.076mm
Minimum Pattern registration tolerance:
+/-0.076mm
Minimum S/M registration tolerance (LPI):
+/-0.076mm
Minimum Annular ring: +/-0.1mm(
artwork)
Minimum S/M bridge (LPI): 0.1mm
Plated
gold thickness: 0.01um – 0.025um
Immersion gold
thickness: 0.025um -- 0.2um |
| Electrical Testing: |
Voltage: 24V - 500V
ontinuity:5 - 100Ohms
Twist and Warp: Less than 1% |
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 Download Capabilities & Specifications(WORD)
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