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·Maximum designed layers: 34 layers |
·Maximum PIN count：42565 |
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·Minimum BGA PIN pitch：0.5mm |
·TI DLP-RAMBUS
RDRAM |
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·10G differential
pair signal |
·DDR&DDRII
SDRAM600Mbps |
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·Minimum line width: 2.0 MIL |
·All kind of Power Design（Switch
Power Supply） |
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·The Related Chipset：Xilinx
VirtexII、VirxtexPro、INTEL2800、2400、1200、MOTOROLA
MPC8260、MPC860、MPC750、BROADCOM 5464、5691、1125、1250 TI
DM642、C6415、C5561、Marvell、Altera
PC104、PCI、CPCI、PCI-X、PCIE、ATCA、High speed back board and so on. |
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| Home | PCB Assembly | Location | About Us | Contact Us | EMC | SI | Term |
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| PCBVIA - No.111,East ChaoYang Road,Kunshan City,JiangSu,China |
| Post Code: 215300 Tel: +86 0512 55177566 Fax: +86 0512 55176707 E-mail: steven@pcbvia.com |
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| This Web Page is Developed By: Hewei Web (www.kunshanweb.com) |
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